Author

@Leoskie_L Leoskie_L

Deep Taiwan/Asia AI-semiconductor supply-chain analyst who reasons from hardware physics to obscure suppliers

Writes long-form, ticker-specific fundamental theses on the

trader score
-1.21
hit rate
55%
mean α
-0.57%
signals 14d
211

Grade = how their written analysis reads (A best). Trader score = how their last-20 timestamped calls performed vs SPY.

Their picks, scored

Across their last 20 scored bets: 55% hit rate, -0.57% mean alpha, trader score -1.21. Their last-14d mentions, direction-adjusted, have moved -6.5% since posting (mean over 145 mentions with price data).

Recent signals15receipts included
date (PT)tickerauthorsentwhat they saidsince thenreceipt
2026-10-16TSM@Leoskie_L+0.20Reports Taiwan plans multiple US supplier parks, beginning in Texas at a stated $2B-$4B cost.+1.4%
2026-10-16NVDA@Leoskie_L+0.10Reports Taiwan plans multiple US supplier parks, beginning in Texas at a stated $2B-$4B cost.-1.5%
2026-10-16LITE@Leoskie_L+0.15Analyzes OCI optical-channel demand and explains why channel counts do not equal laser-unit demand.-8.2%
2026-10-16AAOI@Leoskie_L+0.10Analyzes OCI optical-channel demand and explains why channel counts do not equal laser-unit demand.-10.7%
2026-10-16AVGO@Leoskie_L+0.20Analyzes OCI optical-channel demand and explains why channel counts do not equal laser-unit demand.-2.2%
2026-10-16COHR@Leoskie_L+0.10Analyzes OCI optical-channel demand and explains why channel counts do not equal laser-unit demand.-10.1%
2026-10-163110.T@Leoskie_L+0.45Reports T-glass supply remains tight until new Nittobo capacity can contribute from April 2027.·
2026-10-16NVDA@Leoskie_L+0.10Reports T-glass supply remains tight until new Nittobo capacity can contribute from April 2027.-1.5%
2026-10-15NVDA@Leoskie_L+0.15Argues substrate shortages are real but sell-side margin estimates are overstated, with T-glass the key bottleneck.-2.9%
2026-10-15BESI@Leoskie_L-0.45Analyzes ASML bonding patents and argues logic chips may adopt D2W before HBM, threatening BESI.·
2026-10-15AMAT@Leoskie_L+0.05Analyzes ASML bonding patents and argues logic chips may adopt D2W before HBM, threatening BESI.-12.3%
2026-10-15ASML@Leoskie_L+0.45Analyzes ASML bonding patents and argues logic chips may adopt D2W before HBM, threatening BESI.-5.2%
2026-10-15TSM@Leoskie_L+0.20Says TSM validates end demand directly while equipment vendors lack equivalent visibility.-0.9%
2026-10-15MU@Leoskie_L+0.25Reports Micron opening a Taichung HBM packaging-test facility with 2027 capacity already booked.-5.8%
2026-10-15CRDO@Leoskie_L+0.40Reports Credo's 1.6T active optical cable with stated power, weight, reach, and 2027 shipment targets.-17.5%

Grade is our human read-worthiness rating; trader score is a rolling 20-bet hit-rate/alpha composite — different things, often disagreeing. “Since then” is direction-unaware in the table; the summary line above adjusts for which way they leaned.